Researcher Profile

Field: High Performance Vision

Main Research: Sensing and Embedded Computing

Experience:

- Development of the first color line-scan camera world-wide with 100kHz line-rate.

- Development and manufacturability of a fast line-scan lens for the camera above - both, camera and lens together, were key pre-requisites for the success of the later OBIS3 banknote inspection system.

- Development of the xposure multi-line-scan sensor that achieves unprecedented 600 kHz line-scan-rate. - Development of the xposure-camera, based on the xposure sensor, which is currently the fastest line-scan camera worldwide.

- Development of xposure-flash, a ultra-fast strobed LED line illumination for advanced in-line inspection by sequentially illuminating from multiple directions; this makes our inspection technology more robust and more discriminative.

- My motivation: bringing our in-line aquisition technologies beyond the state-of-the art for the success of our customers.

• 1998-2000: Mixed Signal Circuit Designer
  Infineon Technologies, Villach / Austria
• 2000-2004: Digital Circuit Design
  Infineon Technologies, Vienna / Austria
• 1993-1996: Vertragsassistent
  TU Wien, Institut für Elektrische Regelungsechnik / Austria

• Zur Stabliltätsanalyse von Fuzzy-Regelungen mit Hilfe der Hyperstabilitätstheorie
  Author(s): R. Noisser, E. Bodenstorfer
  Journal: at – Automatisierungstechnik, 45 (1997) ; 2
• Tri-linear color multi-linescan sensor with 200 kHz line rate
  Author(s): O. Schrey, W. Brockherde, C. Nitta, B. Bechen, E. Bodenstorfer, J. Brodersen, K. Mayer
  Journal: Solid-State Electronics, 125 (2016) ; 220 - 226

• High-Performance Smart Cameras;
  Smart Cameras
  Author(s): Fürtler, E. Bodenstorfer, M. Rubik, K. Mayer, J. Brodersen, Ch. Eckel
  Publisher: Springer; 2009
  Series:
• FlexWarp, a Fast and Flexible Method for High-Precision Image Registration: A Nonparametric Approach for Precise Image Registration Applied to Industrial Print Inspection;
  Integrated Imaging and Vision Techniques for Industrial Inspection: Advances and Applications
  Author(s): H. Penz, F. Daubner, E. Bodenstorfer, R. Huber-Mörk
  Publisher: Springer; 2015; 978-1-4471-6741-9
  Series:

• Ultra-Fast 2K Line-Scan Sensor for Industrial Inspection Applications
  Author(s): O. Schrey, C. Nitta, B. Bechen, E. Bodenstorfer, J. Brodersen, K. Mayer, W. Brockherde
  Conference SPIE Optical Metrology Conference, München, Deutschland
• FPGA Based Image Processing for Optical Surface Inspection with Real Time Constraints
  Author(s): Hasani Ylber, E. Bodenstorfer, J. Brodersen, K. Mayer
  Conference 7th International Conference on Machine Vision, Mailand, Italien
• Multiple Input Digital Arbiter with Timestamp Assignment for Asynchronous Sensor Arrays
  Author(s): M. Hofstätter, A.N. Belbachir, E. Bodenstorfer, P. Schön
  Conference 13th IEEE International Conferece on Electronics, Circuits and Systems, Nice, France
• Schnelles FPGA-basiertes Bildaufnahme- und Verarbeitungssystem
  Author(s): Hasani Ylber, E. Bodenstorfer, J. Brodersen, J. Fürtler, K. Mayer
  Conference Austrochip 2011, Wien, Österreich
• High-Performance Camera Module for fast Quality Inspection in Industrial Printing Applications
  Author(s): J. Fürtler, E. Bodenstorfer, K. Mayer, J. Brodersen, D. Heiss, H. Penz, Ch. Eckel, K. Gravogl, H. Nachtnebel
  Conference Electronic Imaging Conference 2007, San José, California, USA
  Proceedings F. Meriaudeau, K.S. Niel ; Volume 6503: Machine Vision Applications in Industrial Inspection XV
• Hochgeschwindigkeitsfarbzeilenkamera mit intelligenter Datenvorverarbeitung
  Author(s): Ch. Eckel, E. Bodenstorfer, H.P. Nachtnebel, P. Rössler, J. Fürtler, K. Mayer
  Conference Austrochip 2006 Mikroelektroniktagung, Wien, Österreich
• High-Speed Line-Scan Camera with Multi-Line CMOS Color Sensor
  Author(s): E. Bodenstorfer, Hasani Ylber, J. Fürtler, J. Brodersen, K. Mayer
  Conference CVPRW 2012; IEEE Computer Society Conference on Computer Vision and Pattern Recognition Workshops, Providence, RI, USA
• Parametrierung einer komplexen Signalverarbeitungskette am Beispiel einer Hochgeschwindigkeitskamera
  Author(s): E. Bodenstorfer, J. Fürtler, Ch. Eckel
  Conference Mikroelektroniktagung 2008, Wien, Österreich
• High-speed Line-Scan Camera with Digital Time Delay Integration
  Author(s): E. Bodenstorfer, J. Fürtler, J. Brodersen, K. Mayer, Ch. Eckel, K. Gravogl, H. Nachtnebel
  Conference Electronic Imaging Conference 2007, San José, California, USA
  Proceedings N. Kehtarnavaz, M. Carlsohn; Volume 6496: Real-Time Image Processing IV; 64960I-1 - 64960I-10
• A Monolithically Integrated Capacitive Pressure Sensor System for Automotive Applications
  Author(s): Kolle, C., Maier-Schneider, D., Logiudice, A., Noé, R., Bodenstorfer, E., Gwehenberger, L., Draxelmayr, D.
  Conference 36th Int. Conf. on Microelectronics, Devices and Materials, Postojna, Slovenia

• SCHALTUNGSANORDNUNG ZUR ERKENNUNG EINES FEHLERZUSTANDS
  Inventor: U. Ausserlechner, E. Bodenstorfer
  Submission Date: 27.02.2019
  Issue Date: 07.12.2006
• Titel AFC-Verfahren und AFC-Schaltung für W-CDMA-Empfänger zum Beherrschen der Rahmengrenzenausnahme mit minimaler Latenz
  Inventor: W. Haas, E. Bodenstorfer, M. Hofstätter, Th. Ruprich, H. Neuhaus
  Submission Date: 27.02.2019
  Issue Date: 20.10.2005
• Verfahren und Vorrichtung zum Kombinieren von Symbolen für unterschiedliche Sendeantennendiversität in einem Rake- Empfänger
  Inventor: G. Sauzon, E. Bodenstorfer, Ch. Drewes
  Submission Date: 27.02.2019
  Issue Date: 09.11.2005
• Titel Verfahren und Vorrichtung zur Durchführung einer Multiplikations- oder Divisionsoperation in einer elektronischen Schaltung
  Inventor: Ch. Drewes, E. Bodenstorfer, J. Niederholz
  Submission Date: 27.02.2019
  Issue Date: 18.05.2006
• TDI-Bildaufnahmeeinheit
  Inventor: E. Bodenstorfer, K. Mayer, D. Heiss
  Submission Date: 05.02.2007
  Issue Date: 15.02.2008
• Verfahren und Schaltung zur Integration von Pixelsignalwerten
  Inventor: E. Bodenstorfer, K. Mayer, J. Fürtler, D. Heiss
  Submission Date: 27.02.2019
  Issue Date: 15.09.2009
• Verfahren zur Aufnahme bewegter Gegenstände
  Inventor: E. Bodenstorfer, K. Mayer, J. Fürtler, D. Heiss
  Submission Date: 20.02.2008
  Issue Date: 15.09.2009

• Publications AIT publications database
• CV as pdf