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IoT sensor systems will be increasingly used in safety related applications (automotive, energy, other infrastructure, health sector). Real, digital and virtual world are converging creating smart environments making production, energy, health, transport, society, cities and many other areas more intelligent – with resulting new societal needs. A broad availability of very small and inexpensive sensor solutions, in particular in the form of MEMS (Micro-Electro-Mechanical Systems), is one of the prerequisites for ubiquitous IoT.

There is a need for pilot lines allowing the flexible production of electronic components and systems, both, front end and back end, at low prices. Absence of potentially (life-threatening) failures in products is a must! Increased vulnerability of the IoT to security attacks make targeted safety- as well as security-focused measures indispensable.


In particular, IoSense aimed at flexible, adaptive, highly reliable and cost-effective sensor networks targeting

  • Industrial leadership by cost reduction in test and certification of reliable IoT sensor systems and by improved smart vision-based sensor networks
  • Solving societal challenges: health monitoring for the aging society, improved environmental monitoring & reduced pollution due to optimized resource consumption
  • Scientific excellence by new risk assessment methodologies (safety&security),
  • by efficient quality measurement of large and flexible sensor networks, and by improved algorithms for adaptive vision-based sensor networks.


Project results serve to Boost the competitiveness of European Electronics Components and Systems industries:

  • establish pilot lines in MtM3
  • support integrated technology solutions (ASICs, test beds, packaging, assembly...),
  • accelerate the uptake of key enabling technologies (e.g. Factory of the Future), in particular sensors+MEMS,
  • Increase manufacturing capacity of sensor/MEMS components by a factor of 10,
  • Reduce manufacturing cost by highly effective process technologies by 30%,
  • Reduce manufacturing time by flexible FE/BE processes & easy reuse by 30%,
  • Reduce time for idea-to-market for new sensor systems down to less than one year.


1 Front End / Back End
2 Internet of Things (Everything)
3 “More than Moore“, i.e. a greater increase in functional capabilities than predicted by Moore’s Law for increasing miniaturization of integrated electronic circuits



Project duration: May 2016 – April 2019

Coordination: Infineon Technologies (DE)

Budget: 70 M€

Funding: 29 M€

Partners (i.a.)

  • Industry: Austria: Infineon AG, Andritz AG, Zumtobel, ams AG;
    weitere: Infineon Technologies  AG (DE), Thales Alenia Space (ES), Philips Lightning BV (NL), IMA Materialforschung und Anwendungstechnik GmbH (DE), XENON Automatisierungstechnik GmbH (DE), IXION Industry and Aerospace  ACE SL (ES), Integrasys SA (ES), Dr. Födisch Umweltmesstechnik AG (DE), Siemens AG (DE)
  • SME: Centre Tecnologic de Telecomunicacions de Catalunya (ES), Powertec SRO (SK), Boschann Technologies BV (NL), Advanced Packaging Center BV (NL)
  • Academia: Austria: TU Graz, ViF, Materials Center LeobenForschung GmbH, CTR, FH Burgenland;
    other countries: TU Bratislava, Agencia Estatal Consejo Superior de Investigaciones Cientificas (ES), FAV (DE), Interuniversitäir Micro-Electronicacentrum IMEC VZW (BE), TU Delft (NL), TU Dresden (DE), Tecnalia (ES)