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Researcher Profile

Dipl.-Ing. Dr. Ernst Bodenstorfer

Dipl.-Ing. Dr. Ernst Bodenstorfer

Function

Scientist

Center

Vision, Automation & Control

Competence Unit

High-Performance Image Processing

E-Mail

Ernst.Bodenstorfer(at)ait.ac.at

Phone

+43 50550 3156

Address

Giefinggasse 4, 1210 Vienna

Career

Field: High Performance Vision

Main Research: Sensing and Embedded Computing

Experience:

- Development of the first color line-scan camera world-wide with 100kHz line-rate.

- Development and manufacturability of a fast line-scan lens for the camera above - both, camera and lens together, were key pre-requisites for the success of the later OBIS3 banknote inspection system.

- Development of the xposure multi-line-scan sensor that achieves unprecedented 600 kHz line-scan-rate. - Development of the xposure-camera, based on the xposure sensor, which is currently the fastest line-scan camera worldwide.

- Development of xposure-flash, a ultra-fast strobed LED line illumination for advanced in-line inspection by sequentially illuminating from multiple directions; this makes our inspection technology more robust and more discriminative.

- My motivation: bringing our in-line aquisition technologies beyond the state-of-the art for the success of our customers.

  • 1998-2000: Mixed Signal Circuit Designer
    Infineon Technologies, Villach / Austria
  • 2000-2004: Digital Circuit Design
    Infineon Technologies, Vienna / Austria
  • 1993-1996: Vertragsassistent
    TU Wien, Institut für Elektrische Regelungsechnik / Austria

Publications

  • Zur Stabliltätsanalyse von Fuzzy-Regelungen mit Hilfe der Hyperstabilitätstheorie
    Author(s): R. Noisser, E. Bodenstorfer
    Journal: at – Automatisierungstechnik, 45 (1997) ; 2
  • Tri-linear color multi-linescan sensor with 200 kHz line rate
    Author(s): O. Schrey, W. Brockherde, C. Nitta, B. Bechen, E. Bodenstorfer, J. Brodersen, K. Mayer
    Journal: Solid-State Electronics, 125 (2016) ; 220 - 226
  • High-Performance Smart Cameras;
    Smart Cameras

    Author(s): Fürtler, E. Bodenstorfer, M. Rubik, K. Mayer, J. Brodersen, Ch. Eckel
    Publisher: Springer; 2009
    Series:
  • FlexWarp, a Fast and Flexible Method for High-Precision Image Registration: A Nonparametric Approach for Precise Image Registration Applied to Industrial Print Inspection;
    Integrated Imaging and Vision Techniques for Industrial Inspection: Advances and Applications

    Author(s): H. Penz, F. Daubner, E. Bodenstorfer, R. Huber-Mörk
    Publisher: Springer; 2015; 978-1-4471-6741-9
    Series:
  • Ultra-Fast 2K Line-Scan Sensor for Industrial Inspection Applications
    Author(s): O. Schrey, C. Nitta, B. Bechen, E. Bodenstorfer, J. Brodersen, K. Mayer, W. Brockherde
    Conference SPIE Optical Metrology Conference, München, Deutschland
  • FPGA Based Image Processing for Optical Surface Inspection with Real Time Constraints
    Author(s): Hasani Ylber, E. Bodenstorfer, J. Brodersen, K. Mayer
    Conference 7th International Conference on Machine Vision, Mailand, Italien
  • Multiple Input Digital Arbiter with Timestamp Assignment for Asynchronous Sensor Arrays
    Author(s): M. Hofstätter, A.N. Belbachir, E. Bodenstorfer, P. Schön
    Conference 13th IEEE International Conferece on Electronics, Circuits and Systems, Nice, France
  • Schnelles FPGA-basiertes Bildaufnahme- und Verarbeitungssystem
    Author(s): Hasani Ylber, E. Bodenstorfer, J. Brodersen, J. Fürtler, K. Mayer
    Conference Austrochip 2011, Wien, Österreich
  • High-Performance Camera Module for fast Quality Inspection in Industrial Printing Applications
    Author(s): J. Fürtler, E. Bodenstorfer, K. Mayer, J. Brodersen, D. Heiss, H. Penz, Ch. Eckel, K. Gravogl, H. Nachtnebel
    Conference Electronic Imaging Conference 2007, San José, California, USA
    Proceedings F. Meriaudeau, K.S. Niel ; Volume 6503: Machine Vision Applications in Industrial Inspection XV
  • Hochgeschwindigkeitsfarbzeilenkamera mit intelligenter Datenvorverarbeitung
    Author(s): Ch. Eckel, E. Bodenstorfer, H.P. Nachtnebel, P. Rössler, J. Fürtler, K. Mayer
    Conference Austrochip 2006 Mikroelektroniktagung, Wien, Österreich
  • High-Speed Line-Scan Camera with Multi-Line CMOS Color Sensor
    Author(s): E. Bodenstorfer, Hasani Ylber, J. Fürtler, J. Brodersen, K. Mayer
    Conference CVPRW 2012; IEEE Computer Society Conference on Computer Vision and Pattern Recognition Workshops, Providence, RI, USA
  • Parametrierung einer komplexen Signalverarbeitungskette am Beispiel einer Hochgeschwindigkeitskamera
    Author(s): E. Bodenstorfer, J. Fürtler, Ch. Eckel
    Conference Mikroelektroniktagung 2008, Wien, Österreich
  • High-speed Line-Scan Camera with Digital Time Delay Integration
    Author(s): E. Bodenstorfer, J. Fürtler, J. Brodersen, K. Mayer, Ch. Eckel, K. Gravogl, H. Nachtnebel
    Conference Electronic Imaging Conference 2007, San José, California, USA
    Proceedings N. Kehtarnavaz, M. Carlsohn; Volume 6496: Real-Time Image Processing IV; 64960I-1 - 64960I-10
  • A Monolithically Integrated Capacitive Pressure Sensor System for Automotive Applications
    Author(s): Kolle, C., Maier-Schneider, D., Logiudice, A., Noé, R., Bodenstorfer, E., Gwehenberger, L., Draxelmayr, D.
    Conference 36th Int. Conf. on Microelectronics, Devices and Materials, Postojna, Slovenia
  • SCHALTUNGSANORDNUNG ZUR ERKENNUNG EINES FEHLERZUSTANDS
    Inventor: U. Ausserlechner, E. Bodenstorfer
    Submission Date: 27.02.2019
    Issue Date: 07.12.2006
  • Titel AFC-Verfahren und AFC-Schaltung für W-CDMA-Empfänger zum Beherrschen der Rahmengrenzenausnahme mit minimaler Latenz
    Inventor: W. Haas, E. Bodenstorfer, M. Hofstätter, Th. Ruprich, H. Neuhaus
    Submission Date: 27.02.2019
    Issue Date: 20.10.2005
  • Verfahren und Vorrichtung zum Kombinieren von Symbolen für unterschiedliche Sendeantennendiversität in einem Rake- Empfänger
    Inventor: G. Sauzon, E. Bodenstorfer, Ch. Drewes
    Submission Date: 27.02.2019
    Issue Date: 09.11.2005
  • Titel Verfahren und Vorrichtung zur Durchführung einer Multiplikations- oder Divisionsoperation in einer elektronischen Schaltung
    Inventor: Ch. Drewes, E. Bodenstorfer, J. Niederholz
    Submission Date: 27.02.2019
    Issue Date: 18.05.2006
  • TDI-Bildaufnahmeeinheit
    Inventor: E. Bodenstorfer, K. Mayer, D. Heiss
    Submission Date: 05.02.2007
    Issue Date: 15.02.2008
  • Verfahren und Schaltung zur Integration von Pixelsignalwerten
    Inventor: E. Bodenstorfer, K. Mayer, J. Fürtler, D. Heiss
    Submission Date: 27.02.2019
    Issue Date: 15.09.2009
  • Verfahren zur Aufnahme bewegter Gegenstände
    Inventor: E. Bodenstorfer, K. Mayer, J. Fürtler, D. Heiss
    Submission Date: 20.02.2008
    Issue Date: 15.09.2009

Further Information

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